Dicing Blade Market Report

Dicing Blade is a tool used to groove, cut, and dice silicon, ceramics, compound semiconductors, crystals, glass, and various other materials. Dicing Blades are made with various bonding materials including resin, nickel, or metal. Dicing Blades are available in different sizes in order to meet the requirements of varied applications. Manufacturers are developing blades with enhanced efficiency to carry out precision and accurate cutting and increase the overall productivity.

The Dicing Blade market has been undergoing a number of product launches. One of them is Hybrid Bond Dicing Blades. Faster cutting action, minimum blade dressing, consistent performance, and long lasting are some of the key benefits of this blade. These blades are sturdier as compared to the other blades manufactured with conventional technologies. They will maintain their firm shape and roundness all through the blades life.

Rising Need for Precision Dicing Among the End-User Industries to Drive the Market

Growing need for accurate dicing/cutting, grinding, and polishing among the end-user industries is driving the demand for Dicing Blades. Surge in the awareness among the manufacturers regarding the benefits of Dicing Blades is acting as a key factor fuelling the Dicing Blade market growth. In addition, demand for higher throughput among industries is driving them to opt for dicing blades. Technological advancements are opening up novel avenues for the Dicing Blade market. Moreover, extensive research and development is playing a key role in boosting the Dicing Blade market growth to a great extent.

Players to Launch New Products to Sustain the Competition

Key companies operating in the global Dicing Blade market include ADT, DISCO, K&S, Ceiba, and UKAM. Players are taking up various strategic initiatives such as novel product introduction in order to strengthen their presence in the global Dicing Blade market.

For instance, one of the key companies, DISCO has launched Dicing Blade B1A Series. The key application of these series lies in ceramics, electronic parts, various types of semiconductor packages, mono-crystal ferrite, optical devices, and glass. Sintered metal powder is deployed as the bonding agent material. These blades are known to have low blade wear and are suitable for high precision cutting of optical devices as well as electronics parts. High rigidity and ability to control diamond concentration to gain cutting quality are some of the key aspects of these blades.

Market Segmentation

By Product Type

●  Hub Dicing Blades

●  Hubless Dicing Blades

●  Other

By Application

●  Semiconductors

●  Glass

●  Ceramics

●  Crystals

● Other

The global Dicing Blade market has been bifurcated on the basis of product type as hub dicing blades, Hubless dicing blades, and others. Demand for hub dicing blades is likely to witness a surge as compared to the other product types. The reason being their growing usage in dicing materials like GaAs, silicon, and other wafers As far as the application is concerned, Dicing Blade is extensively deployed to cut and groove semiconductors. The report includes detailed analysis of semiconductors, glass, ceramics, crystals, and other applications.

By Region

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Asia Pacific is expected to witness significant growth in the coming years owing to high consumption in Japan, Korea, and China. Surge in the adoption of Dicing Blades could be another factor contributing to the expansion of the Dicing Blade market in Asia Pacific. The region is anticipated to maintain its lead in the years to come. The US is likely to raise its investment in the Dicing Blade market, which is having a positive impact on the market growth in North America. The regional analysis will give a clear cut understanding to the readers regarding the current and future situations of the global Dicing Blade market.

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